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ZXCL SERIES Micropower SC70-5 & SOT23-5 low dropout regulators
ZXCL5213V25, ZXCL5213V26, ZXCL5213V28, ZXCL5213V30, ZXCL5213V33, ZXCL250, ZXCL260, ZXCL280, ZXCL300, ZXCL330 Description Features
The ZXCL series have been designed with space sensitive systems in mind. They are available in the ultra small SC70-5 package, which is half the size of SOT23 based regulators. The devices can be used with all types of output capacitors including low ESR ceramics and typical dropout voltage, is only 85mV at 50mA load. Supply current is minimised with a ground pin current of only 50 A at full 150mA load. Logic control allows the devices to be shut down, consuming typically less than 10nA. These features make the device ideal for battery powered applications where power economy is critical. For applications requiring improved performance over alternative devices, the ZXCL is also offered in the 5 pin SOT23 package with an industry standard pinout. The devices feature thermal overload and over-current protection and are available with output voltages of 2.5V, 2.6V, 2.8V, 3V, 3.3V. * * * * * * Low 85mV dropout at 50mA load 50 A ground pin current with full 150mA load 2.5, 2.6, 2.8, 3, & 3.3 volts output Very low noise, without bypass capacitor 5-pin SC70 and SOT23 package No-load stable
Applications
* * * * * * Cellular and Cordless phones PDA Hand held instruments Camera, Camcorder, Personal stereo PC cards Portable and battery-powered equipment
No-Load Stability, the ZXCL device will maintain regulation and is stable with no external load. e.g. CMOS RAM applacations.
Typical application circuit Package footprint
SOT23-5 (see P7 for SC70-5) Package suffix - E5
VIN GND EN
Top view
VO
NC
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ZXCL SERIES
Ordering information
Order reference Voltage (V) 2.5 2.6 2.8 3.0 3.3 4.0 2.5 2.6 2.8 3.0 3.3 4.0 Package Part marking L25A L26A L28A L30A L33A L40A L25C L26C L28C L30C L33C L40C Status Reel size (inches) 7 7 7 7 7 7 7 7 7 7 7 7 Tape width (mm) 8 8 8 8 8 8 8 8 8 8 8 8 Quantity per reel 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000
ZXCL250H5TA ZXCL260H5TA ZXCL280H5TA ZXCL300H5TA ZXCL330H5TA ZXCL400H5TA ZXCL5213V25H5TA ZXCL5213V26H5TA ZXCL5213V28H5TA ZXCL5213V30H5TA ZXCL5213V33H5TA ZXCL5213V40H5TA
SC70-5 SC70-5 SC70-5 SC70-5 SC70-5 SC70-5 SC70-5 SC70-5 SC70-5 SC70-5 SC70-5 SC70-5
Active Active Active Active Active Obsolete Active Active Active Active Active Not rec. for new designs Active Active Active Active Active Obsolete
ZXCL250E5TA ZXCL260E5TA ZXCL280E5TA ZXCL300E5TA ZXCL330E5TA ZXCL400E5TA
2.5 2.6 2.8 3.0 3.3 4.0
SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5
L25B L26B L28B L30B L33B L40B
7 7 7 7 7 7
8 8 8 8 8 8
3000 3000 3000 3000 3000 3000
Absolute maximum rating
Terminal Voltage with respect to GND VIN EN VO SC70-5 SOT23-5 -0.3V to 7.0V -0.3V to 10V -0.3V to 5.5V Output short circuit duration Infinite Continuous power dissipation Internally limited Operating temperature range -40C to +85C Storage temperature range -55C to +125C
Package power dissipation (TA=25C) 300mW (Note 1) 450mW (Note 1)
Stresses beyond those listed under "Absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.
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ZXCL SERIES
Recommended operating conditions
Symbol VIN VENH VENL TA Parameter Input voltage range Enable pin logic level High pin Enable pin logic level Low pin Ambient temperature range Min 2.0* 2.2 0 -40 Max 5.5 10 0.8 85 Units V V V C
* Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation, VIN(min) > VOUT(nom) + 0.5V.
Pin description
Symbol VIN GND EN N/C VO Parameter Supply voltage Ground Active HIGH enable input. TTL/CMOS logic compatible. Connect to VIN or logic high for normal operation No connection Regulator output
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ZXCL SERIES
Electrical characteristics VIN = VO = 0.5V, all values at TA = 25C (Unless otherwise stated)
Symbol Parameter VO Output voltage Conditions IO=1mA IO=100mA VO+0.5V < VIN < VIN max Limits Min. Typ. Max. -2% +2% -3% -15 +3% Units V V ppm/C
VO/ T
IO(Max) IOLIM IO
Output voltage temperature coefficient Output current XCL250/5213V25 only Over current limit Ground pin current Dropout voltage note 3 XCL250/5213V25 only No Load IO=150mA IO=100mA IO=10mA All variants IO=50mA IO=100mA ZXCL250 / 5213V25 IO=100mA ZXCL260 / 5213V26 IO=100mA ZXCL280 / 5213V28 IO=100mA ZXCL300 / 5213V30 IO=100mA ZXCL330 / 5213V33 IO=100mA ZXCL400 / 5213V40 VIN=(VO+0.5V) to 5.5V, IO=1mA IO=1mA to 100mA f=10Hz to 100kHz, CO=10 F
150 100 160 105
mA 800 750 50 120 100 mA A A A mV mV mV mV mV mV mV mV %/V %/mA VRMS mV 100 1 nV A C
VDO
VLNR VLDR EN VENHS IEN IOSD TSD
Line regulation Load regulation Output noise voltage Enable pin hysteresis Enable pin input VEN=5.5V current Shutdown supply VEN=0V current Thermal shutdown temperature
230 25 50 40 15 85 163 155 140 140 140 140 0.02 0.01 50 150
325 310 280 280 280 280 0.1 0.04
125
165
Device testing is performed at TA=25C. Device thermal performance is guaranteed by design. Note1: Maximum power dissipation is calculated assuming the device is mounted on a PCB measuring 2 inches square Note2:Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation, VIN(min) > VOUT(nom) + 0.5V. Note3:Dropout voltage is defined as the difference between VIN and VO, when VO has dropped 100mV below its nominal value. Nominal value of VO is defined at VIN=VO+0.5V.
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ZXCL SERIES
Typical characteristics (ZXCL280 / 5213 shown)
6 5 0.25
Dropout Voltage (V)
5 6
0.20 0.15 0.10 0.05 0.00
Voltage (V)
4
VIN
3 2
IOUT = 100mA
1
IOUT = 1mA
0 0 1 2 3 4
0
25
50
75
100
125
150
175
Input Voltage (V)
Output Current (mA)
Input to Output Characteristics
2.81 25.0
Dropout Voltage v Output Current
Ground Current (A)
Output Voltage (V)
VIN = 3.3V No Load
24.8 24.6 24.4 24.2 24.0 23.8 23.6 23.4 23.2 23.0 -50
VIN = 3.3V No Load
2.80
2.79 -50
-25
0
25
50
75
100
-25
0
25
50
75
100
Temperature (C)
Temperature (C)
Output Voltage v Temperature
30 60
Ground Current v Temperature
Ground Current (A)
25 20 15 10 5 0 0 1 2 3 4 5
Ground Current (A)
No Load
55 50 45 40 35 30 25 20 0 25 50 75 100 125 150
VIN = 5V VIN = 3.3V
Input Voltage (V)
Load Current (mA)
Ground Current v Input Voltage
Ground Current v Load Current
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ZXCL SERIES
Typical characteristics
6 5
400 100
IL(mA)
COUT = 1F
Enable VIN = 5V IL = 1mA IL = 100mA VIN = 3.3V IL = 1mA IL = 100mA
350 50 300 0 100
VIN = 5V IL = 1mA to 50mA
Voltage (V)
4 3 2 1 0 0 10 20 30 40 50
VOUT (mV)
50 0 -50 -100 0.0 0.1
COUT = 10F COUT = 1F
COUT = 1F COUT = 10F
60
70
80
90 100
0.2
0.3
0.4
0.5
Time (s)
Time (ms)
Start-Up Response
6 6
Load Response
4 3
VIN (V)
VIN(V)
5
COUT = 1F Tr & Tf = 2.5s
5 4 3
COUT = 1F Tr & Tf = 2.5s
VOUT (mV)
1 20 0 10 -1 0 -2 -10 -3 -20 -4 0.0
VOUT (mV)
0.1 0.2 0.3 0.4 0.5
1 20 0 10 -1 0 -2 -10 -3 -20 -4 0.0
0.1
0.2
0.3
0.4
0.5
Time (ms)
Time (ms)
Line Rejection IL = 1mA
Power Supply Rejection (dB)
80 70 60 50 40 30 20 10 0 10 100 1k
COUT = 10F COUT = 2.2F COUT = 1F All Caps Ceramic Surface Mount
Line Rejection IL = 100mA
10
IL = 100mA, COUT = 1F
Noise V/Hz
IL = 50mA
IL = 100mA, COUT = 10F
1
0.1
No Load, COUT = 1F No Load, COUT = 10F
10k
100k
1M
0.01 10
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
Power Supply Rejection v Frequency
Output Noise v Frequency
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ZXCL SERIES
Connection diagrams
SC70-5 (H5) SC70-5 (H5)
VIN GND EN
Top view
VO
EN N/C*
VIN
NC
GND
VO
Top view * Should be left open circuit or connected to pin 3
ZXCLxxx
ZXCL5213Vxx
Schematic diagram
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ZXCL SERIES
Input to Output Diode
In common with many other LDO regulators, the ZXCL device has an inherent diode associated with the output series pass transistor. This diode has its anode connected to the output and its cathode to the input. The internal diode is normally reverse biased, but will conduct if the output is forced above the input by more than a VBE (approximately 0.6V). Current will then flow from Vout to Vin. For safe operation, the maximum current in this diode should be limited to 5mA continuous and 30mA peak. An external schottky diode may be used to provide protection when this condition cannot be satisfied.
Increased Output current
Any ZXCL series device may be used in conjunction with an external PNP transistor to boost the output current capability. In the application circuit shown below, a FMMT717 device is employed as the external pass element. This SOT23 device can supply up to 2.5A maximum current subject to the thermal dissipation limits of the package (625mW). Alternative devices may be used to supply higher levels of current. Note that with this arrangement, the dropout voltage will be increased by the VBE drop of the external device. Also, care should be taken to protect the pass transistor in the event of excessive output current.
Scheme to boost output current to 2A
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ZXCL SERIES
Applications information
Enable control A TTL compatible input is provided to allow the regulator to be shut down. A low voltage on the Enable pin puts the device into shutdown mode. In this mode the regulator circuit is switched off and the quiescent current reduces to virtually zero (typically less than 10nA) for input voltages above the minimum operating threshold of the device. A high voltage on the Enable pin ensures normal operation. The Enable pin can be connected to VIN or driven from an independent source of up to 10V maximum. (e.g. CMOS logic) for normal operation. There is no clamp diode from the Enable pin to VIN, so the VIN pin may be at any voltage within its operating range irrespective of the voltage on the Enable pin. However input voltage rise time should be kept below 5ms to ensure consistent start-up response. Current Limit The ZXCL devices include a current limit circuit which restricts the maximum output current flow to typically 230mA. Practically the range of over-current should be considered as minimum 160mA to maximum 800mA. The device's robust design means that an output short circuit to any voltage between ground and VOUT can be tolerated for an indefinite period. Thermal Overload Thermal overload protection is included on chip. When the device junction temperature exceeds a minimum 125C the device will shut down. The sense circuit will re-activate the output as the device cools. It will then cycle until the overload is removed. The thermal overload protection will be activated when high load currents or high input to output voltage differentials cause excess dissipation in the device. Start up delay A small amount of hysteresis is provided on the Enable pin to ensure clean switching. This feature can be used to introduce a start up delay if required. Addition of a simple RC network on the Enable pin provides this function. The following diagram illustrates this circuit connection. The equation provided enables calculation of the delay period.
VIN Td(NOM) = RCIn VIN - 1.5 Calculation of start up delay as above
R
C
Figure 1 Circuit Connection
Td
Figure 2 Start up delay (Td)
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ZXCL SERIES
Applications information (Cont)
Power dissipation The maximum allowable power dissipation of the device for normal operation (Pmax), is a function of the package junction to ambient thermal resistance (ja), maximum junction temperature (Tjmax), and ambient temperature (Tamb), according to the expression: Pmax = (Tjmax - Tamb) / ja The maximum output current (Imax) at a given value of Input voltage (VIN) and output voltage (VOUT) is then given by Imax = Pmax / (VIN - VOUT) The value of qja is strongly dependent upon the type of PC board used. Using the SC70 package it will range from approximately 280C/W for a multi-layer board to around 450C/W for a single sided board. It will range from 180C/W to 300C/W for the SOT23-5 package. To avoid entering the thermal shutdo wn state, Tjmax should be assumed to be 125C and Imax less than the over-current limit,(IOLIM). Power derating for the SC70 and SOT23-5 packages is shown in the following graph.
Max Power Dissipation (mW)
500 400
SOT23
The dielectric of the ceramic capacitance is an important consideration for the ZXCL Series operation over temperature. Zetex recommends minimum dielectric specification of X7R for the input and output capacitors. For example a ceramic capacitor with X7R dielectric will lose 20% of its capacitance over a -40 C to 85 C temperature range, whereas a capacitor with a Y5V dielectric loses 80% of its capacitance at -40 C and 75% at 85 C. An input capacitor of 1 F (ceramic or tantalum) is recommended to filter supply noise at the device input and will improve ripple rejection. The input and output capacitors should be positioned close to the device, and a ground plane board layout should be used to minimise the effects of parasitic track resistance. Dropout voltage The output pass transistor is a large PMOS device, which acts like a resistor when the regulator enters the dropout region. The dropout voltage is therefore proportional to output current as shown in the typical characteristics. Ground current The use of a PMOS device ensures a low value of ground current under all conditions including dropout, start-up and maximum load. Power supply rejection and load transient response
300 200
SC70
100 0 -40
Line and Load transient response graphs are shown in the typical characteristics.
60 80 100
-20
0
20
40
Temperature (C)
Derating Curve
These show both the DC and dynamic shift in the output voltage with step changes of input voltage and load current, and how this is affected by the output capacitor. If improved transient response is required, then an output capacitor with lower ESR value should be used. Larger capacitors will reduce over/ undershoot, but will increase the settling time. Best results are obtained using a ground plane layout to minimise board parasitics.
Capacitor selection and regulator stability The device is designed to operate with all types of output capacitor, including tantalum and low ESR ceramic. For stability over the full operating range from no load to maximum load, an output capacitor with a minimum value of 1F is recommended, although this can be increased without limit to improve load transient performance. Higher values of output capacitor will also reduce output noise. Capacitors with ESR less than 0.5V are recommended for best results. Issue 8 - October 2007
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ZXCL SERIES
S70-5 Package outline
Dim. A A1 A2 b C D
Millimeters Min. 0.80 0.80 0.15 0.08 Max. 1.10 0.10 1.00 0.30 0.25
Inches Min. 0.0315 0.0315 0.006 0.0031 Max. 0.0433 0.0039 0.0039 0.0118 0.0098
Dim. E E1 e e1 L
Millimeters Min. Max. 2.10 BSC 1.25 BSC 0.65 BSC 1.30 BSC 0.26 0 0.46 8
Inches Max. Max. 0.0826 BSC 0.0492 BSC 0.0255 BSC 0.0511 BSC 0.010 0 0.018 8
2.00 BSC
0.0787 BSC
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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ZXCL SERIES
SOT23-5 Package outline
DIM A A1 A2 b C D E E1 e e1 L a Min. 0.90 0.00 0.90 0.20 0.09 2.70 2.20 1.30
Millimeters Max. 1.45 0.15 1.30 0.50 0.26 3.10 3.20 1.80 0.95 REF 1.90 REF 0.10 0 0.60 30 0.0039 0 Min. 0.0354 0.00 0.0354 0.0078 0.0035 0.1062 0.0866 0.0511
Inches Max. 0.0570 0.0059 0.0511 0.0196 0.0102 0.1220 0.1181 0.0708 0.0374 REF 0.0748 REF 0.0236 30
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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Intentionally left blank
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Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user's application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labelling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: "Preview" Future device intended for production at some point. Samples may be available "Active" Product status recommended for new designs "Last time buy (LTB)" Device will be discontinued and last time buy period and delivery is in effect "Not recommended for new designs" Device is still in production to support existing designs and production "Obsolete" Production has been discontinued Datasheet status key: "Draft version" This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. "Provisional version" This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. "Issue" This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. Zetex sales offices Europe Zetex GmbH Kustermann-park Balanstrae 59 D-81541 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
(c) 2007 Published by Zetex Semiconductors plc
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